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Manufacturer Part #: XC7K325T-1FFG900C
Product Category: FPGAs (Field Programmable Gate Array)
Manufacturer: Xilinx
Package: 900-BBGA, FCBGA
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: 1 days


Attribute      Attribute Value
Manufacturer:   Xilinx
Product Category: FPGAs (Field Programmable Gate Array)
Series:  Kintex®-7
Number of LABs CLBs: 25475
Number of Logic Elements Cells: 326080
Total RAM Bits:  16404480
Number of I/O:  500
Voltage Supply:   0.95 V ~ 1.05 V
Mounting Type:  Surface Mount
Operating Temperature:  -40℃~ 100℃ (TJ)
Package Case:  900-BBGA, FCBGA
Supplier Device Package: 900-BBGA, FCBGA (31x31)


Product Details

Kintex-7 XC7K325T-1FFG900C : Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7K325T-1FFG900C FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

The Xilinx FPGAs series XC7K325T-1FFG900C is FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at, and you can also search for other FPGAs products.


SpecificationsEnvironmental & Export Classifications

RoHS Status:    ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status:  REACH Unaffected
ECCN:  3A991D
HTSUS:   8542.39.0001



  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Offer in 24 hours

Competitive price

No counterfeit parts

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