Offer in 24 hours

Competitive price

No counterfeit parts


Manufacturer Part #: XC7K160T-2FF676I
Product Category: FPGAs (Field Programmable Gate Array)
Manufacturer: Xilinx
Package: 676-BBGA, FCBGA
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Lead Time: 2 days


Attribute      Attribute Value
Manufacturer:   Xilinx
Product Category: FPGAs (Field Programmable Gate Array)
Series:  Kintex®-7
Number of LABs CLBs: 12675
Number of Logic Elements Cells: 162240
Total RAM Bits:  11980800
Number of I/O:  400
Voltage Supply:   0.95 V ~ 1.05 V
Mounting Type:  Surface Mount
Operating Temperature:  -40℃~ 100℃ (TJ)
Package Case:  676-BBGA, FCBGA
Supplier Device Package: 676-BBGA, FCBGA (27x27)


Product Details

Kintex-7 XC7K160T-2FF676I : Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7K160T-2FF676I FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

The Xilinx FPGAs (Field Programmable Gate Array) series XC7K160T-2FF676I is FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 162240 Cells, 970 mV to 1.03 V, FCBGA-676, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at, and you can also search for other FPGAs products.


SpecificationsEnvironmental & Export Classifications

RoHS Status:    ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status:  REACH Unaffected
ECCN:  3A991D
HTSUS:   8542.39.0001



  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Offer in 24 hours

Competitive price

No counterfeit parts

Subscribe to our newsletter

Sign up for our newsletter to recieve news, promotions, and annoucements.